Service eMMC

Ketua Teknisi HP (Official) VIVO Y12i File Backupan Vivo Y12i Qualcomm Masi Mentah-Link Google Drive .File/Firmware ini kami backup setelah melakukan penghapusan Pola,Sandi,Akun google,artinya file ini kami backup dalam kondisi normal jaya menggunakan Ribak-Tool, file bisa digunakan untuk keperluan flashing Misal masalah bootloop,hang logo,mati total 9008 dan sebagainya,jika berkenan silahkan diunduh... Log Info Adb Device: Operation: Runing Phone Mode: Adb Mode UT-Sync Server: OK Register: OK Start Modul: OK ___________________________ Searching Device: OK Gathering Phone Info: OK Brand: vivo Model: vivo 2007 Android Version: 11 Description: 1906-user 11 RP1A.200720.012 eng.compil.20211009.162104 release-keys Build Id: RP1A.200720.012 Build Version: eng.compil.20211009.162104 Build Host: comsz01078096 Build Flavor: msm8937_64-user Flatform: arm64-v8a Cpu Abilist: arm64-v8a,armeabi-v7a,armeabi Cpu Abilist32: armeabi-v7a,armeabi Cpu Abilist64: arm64-v8a Board Flatform: qcom Boot device:

Ketua Teknisi HP (Official) Firmware Backup Mi a1 Tissot File Backupan Mi A1-File Masi Mentah .File ini kami backup menggunakan Ribak-Tool Dengan kondisi normal jaya,mana kala dibutuhkan untuk repair seperti bootloop-hang-logo,mati total mode 9008 dsan seterusnya,silahkan diunduh dengan gratis...... Log Backup Ribak-Tool: Operation: Runing Phone Mode: Edl Mode UT-Sync Server: OK Register: OK Start Modul: OK ___________________________ Searching device...QDloader 9008 3 Get hardware info Qualcomm HS USB QDLoader 9008 Device Connection Status : XHCI_HUB_USB High-Speed Driver Manufacturer : Qualcomm Incorporated SerialNumber: 0x3933cbc3 MSM_HW_ID: 0x000460e1 OEM_PK_HASH: 0x57158eaf1814d78fd2b3105ece4db18a817a08ac664a5782a925f3ff8403d39a SBL SW Version: 0x00000000 Sending boot... Done Storage_info... 1221427205123210RH64MB Partition Info... Boot 1:4096 Boot 2:4096 user area :6107 Get system info  System Info... ENCRYPTED USBType : persist.mtp,mass_storage Build ID : PKQ1.180917.001 PATCH

Ketua Teknisi HP (Official) firmware nokia 6 Firmware BACKUPAN Nokia 6 TA-1021-Link New Google Drive .Firmware kami backup menggunakan Ribak-Tool, HP Dalam kondisi normal,mana kala membutuhkan file untuk perbaikan seperti HANG LOGO-BOOTLOOP-MATI TOTAL MODE 9008 ,Silahkan flashing menggunakan ini..firmware bisa juga diflash menggunakan tool qualcomm lain seperti Qpst.Qfil dll...jika berkenan silahkan langsung di unduh Log Backup Ribak Tool: Operation: Runing Phone Mode: Edl Mode UT-Sync Server: OK Register: OK Start Modul: OK ___________________________ Searching device...QDloader 9008 3 Get hardware info Qualcomm HS USB QDLoader 9008 Device Connection Status : XHCI_HUB_USB High-Speed Driver Manufacturer : Qualcomm Incorporated Sending boot...OK Authentication Server... continue Authentication Skip Storage_info... 61071360512314474HBG4a2 Partition Info... Boot 1:4096 Boot 2:4096 user area :30535.5 Get system info  System Info... ENCRYPTED USBType : persist.mtp,mass_storage Build ID : N

Ketua Teknisi HP (Official) File eMMC Infinix HOT 9 File Dump eMMC iNFINIX HOT 9 .DIbeberapa situasi file dump ini dibutuhkan saat proses pergantian ic emmc pada smartphone yang menggunakan chip Mediatek..langsung saja diunduh jika memang diperlukan Log Ufi Box: VCC: 3.3 V, VCCQ: 3.0 V Bus: 8 bit (HS SDR 52MHz) Access mode: sector mode Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V) Card/BGA: BGA (Discrete embedded) - High density MMC Manufacturer ID: 0x15 (Samsung) Product name: DP6DAB (0x445036444142), rev: 0x03, serial number: 0x76CDCE16 Manufacturing date: May 2020 CID: 15010044 50364441 420376CD CE16571C CSD: D0270132 0F5903FF F6DBFFEF 8E40400C EXT_CSD revision: 1.8 (MMC v5.1)  Partition info: Boot1: 4 MiB Boot2: 4 MiB RPMB: 16 MiB [Authentication Key not yet programmed] User area: 58.24 GiB(62,537,072,640 bytes) Cache size: 64 MiB Hardware reset function: 1 Partition configuration: 0x48 Boot acknowledge is sent during the boot operation Boot partition 1 is enabled for boot Part

Ketua Teknisi HP (Official) DUMP REDMI 7A File Dump eMMC Redmi 7A Pine .Dibeberapa kondisi file dump ini dibutuhkan dalam proses pergantian ic emmc,meskipun banyak cara dengan methode pasangan kosongan.silahkan unduh filenya free... Log Ufi Box Connection status: EHCI:HUB:HUB[#4]:USB 2.00 High-Speed Interface: UFI High-Speed Serial number:   Boot version: 1.03, FW version: 1.13 (Aug 19 2019 23:46:09) Insertion test... Done Init bus... VCC: 3.3 V, VCCQ: 3.0 V Bus: 8 bit (HS SDR 52MHz) Access mode: sector mode Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V) Card/BGA: BGA (Discrete embedded) - High density MMC Manufacturer ID: 0x90 (SK Hynix) Product name: HAG4a2 (0x484147346132), rev: 0xA5, serial number: 0x5163B475 Manufacturing date: Jan 2019 CID: 90014A48 41473461 32A55163 B4751654 CSD: D0270132 8F5903FF FFFFFFE7 8A400016 EXT_CSD revision: 1.8 (MMC v5.1)  Partition info: Boot1: 4 MiB Boot2: 4 MiB RPMB: 4 MiB [Provisioned, counter: 95472] User area: 14.68 GiB(15,758,000,128 bytes) Ca

Ketua Teknisi HP (Official) File eMMC TULIP File Dump eMMC Redmi Note 6 Pro (Tulip). Dibeberapa kondisi file dump ini dibutuhkan dalam proses pergantian ic emmc,meskipun banyak cara dengan methode pasangan kosongan.silahkan unduh filenya free... Log Ufi Box Connection status: EHCI:HUB:HUB[#4]:USB 2.00 High-Speed Interface: UFI High-Speed Serial number:  Boot version: 1.03, FW version: 1.13 (Aug 19 2019 23:46:09) Insertion test... Done Init bus... VCC: 3.3 V, VCCQ: 3.0 V Bus: 8 bit (HS SDR 52MHz) Access mode: sector mode Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V) Card/BGA: BGA (Discrete embedded) - High density MMC Manufacturer ID: 0x45 (SanDisk) Product name: DA4064 (0x444134303634), rev: 0x01, serial number: 0x1318D53D Manufacturing date: Aug 2018 CID: 45010044 41343036 34011318 D53D85A6 CSD: D00F0032 8F5903FF FFFFFFEF 8A404022 EXT_CSD revision: 1.8 (MMC v5.1)  Partition info: Boot1: 4 MiB Boot2: 4 MiB RPMB: 16 MiB [Provisioned, counter: 132243] User area: 58.24 GiB(62,537,072,