Ketua Teknisi HP (Official)
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| FILE EMMC TECNO |
File Dump eMMC Tecno LE6 Langsung ON-Link 2024.File dump backup langsung dari ic emmcnya,bisa digunakan untuk perbaikan maupun pergantian ic emmc pada TECNO.silahkan unduh bagi yang membutuhkan
Untuk pengisian/write emmc secara umum sebagai berikut :
01.Ext_CSD Write
02.Boot1 Write
03.Boot2 Write
04.User area Write
05,Restore Security/Userpart
06.Pasang
Jika pemasangan pass harusnya langsung on,jika tidak masuk menu maupun bootloop lakukan full flash menggunakan UFS tool Maupun tool lainya
LOG
Info System
FINGERPRINT : TECNO/LE6-GL/TECNO-LE6:11/RP1A.200720.011/211014V173:user/release-keys
Manufacturer : ro.TECNO-LE6
BUILD ID : RP1A.200720.011
SECURITY PATCH : 2021-09-05
CPU ABI : arm64-v8a
CPU ABILIST : arm64-v8a,armeabi-v7a,armeabi
CPU ABILIST32 : armeabi-v7a,armeabi
CPU ABILIST64 : arm64-v8a
LOCALE : en-US
Build Description : vnd_le6_h6222-user 11 RP1A.200720.011 174514 release-keys
Platform : mt6765
BUILD : TECNO/LE6-GL/TECNO-LE6:11/RP1A.200720.011/211014V173:user/release-keys
ODM NAME : LE6-GL
SUPPORT PRELOADER
EMIInfo{0x0}:150100445036444142:0x15:Samsung:DP6DAB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):4.00GB
EMIInfo{0x1}:150100445836384d42:0x15:Samsung:DX68MB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):3.00GB
EMIInfo{0x2}:90014a68433861503e:0x90:SkHynix:hC8aP>:0x4a:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):4.00GB
EMIInfo{0x3}:90014a68423861503e:0x90:SkHynix:hB8aP>:0x4a:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):3.00GB
EMIInfo{0x4}:150100335636434d42:0x15:Samsung:3V6CMB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):6.00GB
EMIInfo{0x5}:150100335636434242:0x15:Samsung:3V6CBB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):6.00GB
EMIInfo{0x6}:150100445036444242:0x15:Samsung:DP6DBB:0x0:BGA (Discrete embedded):DRAM:MCP(eMMC+LPDR4X):4.00GB
File dump tecno le6.Selamat mencoba dan semoga sukses.Fimrware backup TECNO LE6
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