Service emmc & Repair guide
VCC: 3.3 V, VCCQ: 2.8 V
Bus: 4 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x11 (Toshiba)
Product name: 032G74 (0x303332473734), rev: 0x00, serial number: 0xF18F1799
Manufacturing date: Oct 2015
CID: 11010030 33324737 3400F18F 1799A2C4
CSD: D0270032 0F5903FF FFFFFFE7 8640009A
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 4 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6795, cpu abi: arm64-v8a
manufacturer: Xiaomi
board: hennessy, name: hennessy
brand: Xiaomi, model: Redmi Note 3
build id: LRX22G, version: 5.0.2 Lollipop (LRX22G)
build description: hennessy-user 5.0.2 LRX22G V7.0.19.0.0.LHNCNCJ release-keys
Internal storage: 26.27 GiB
 |
| Log emmc xiaomi |
Bus: 4 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x11 (Toshiba)
Product name: 032G74 (0x303332473734), rev: 0x00, serial number: 0xF18F1799
Manufacturing date: Oct 2015
CID: 11010030 33324737 3400F18F 1799A2C4
CSD: D0270032 0F5903FF FFFFFFE7 8640009A
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 4 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6795, cpu abi: arm64-v8a
manufacturer: Xiaomi
board: hennessy, name: hennessy
brand: Xiaomi, model: Redmi Note 3
build id: LRX22G, version: 5.0.2 Lollipop (LRX22G)
build description: hennessy-user 5.0.2 LRX22G V7.0.19.0.0.LHNCNCJ release-keys
Internal storage: 26.27 GiB
- Log ini di ambil dari UFIBOX Dengan adanya ini mudah-mudahan bisa membantu kawan-kawan yang ingin melakukan pergantian ic emmc/emcp bisa menjadi lebih mudah.Bantu share jika artikel ini bermanfaat Terima Kasih.
Untuk jenis emmc lain yang mendukung bisa lanjut di sini Suport ic emmc all brand File dump bisa di ambil di sini File dump emmc xiaomi lengkap
Selamat mencoba dan Semoga Sukses
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